September 28, 2020


Toshiba Launches 5-Watt Chipset For Fast Wireless Charging

Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announces new enhancements to its TB6865FG power transmitter and TC7763WBG receiver chipset enabling wireless power transfer to more quickly charge mobile devices. The TAEC wireless power chipset now supports 5-watt power transfer; is compatible with the Qi low-power specifications version 1.1 defined by the Wireless Power Consortium (WPC), including rigorous Foreign Object Detection (FOD); and has integrated digital controller logic that reduces component count and minimizes design complexity.

TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC. TB6865FG AND TC7763WBG

“We are seeing a strong interest in wireless power technology for products like smartphones, game controllers, and other portable devices,” says Deepak Mithani, senior director of the Mixed Signal Business Unit, System LSI Group at TAEC. “Besides the advantage of charging a device without the use of a cable, one interesting and emerging application is for mobile waterproof gadgets where a device is fully enclosed in its housing with no exposed connectors. Customers are demanding a quick way to charge their portable electronics and this chipset provides a convenient and effective way to satisfy their demand.”

The TAEC wireless power chipset is built with the company’s mixed-signal process with optimized MOSFET design that achieves high-performance allowing mobile device placement on the battery charging pad. The TC7763 realize a wireless power solution with a transmitter that consists of the TB6865FG transmitter. The TB6865FG integrates an MCU and can drive 4 external MOSFET H Bridges of 4 coils for a free positioning architecture supporting two mobile devices. The TC7763WBG receiver combines modulation and control circuitry with a rectifier power pickup, built-in Linear Dropout Regulator (LDO) and circuit protection functions. The transmitter IC is housed in a LQFP-100 14x14mm package and the receiver IC is supplied in a compact WCSP-28 2.4mm x 3.67mm x 0.5mm package.

The earlier TC7761WBG part has been awarded Qi certification at output power of 3.5-watt.

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