Within the scope of its comprehensive range of SMT fine pitch connectors, ERNI Electronics has significantly extended the MicroCon connector family. In addition to the 50-pin straight male and female connectors originally introduced, other versions with different numbers of pins, heights and also in angled variants are available for delivery at short notice. With an innovative, modular tool manufacturing concept for the insulator body, ERNI is capable – within just six weeks from the time of receiving the order – of supplying versions with pin numbers from 12 to 140 and heights of 1.0 mm or 2.0 mm for the male connectors as well as 4.0 mm, 6.0 mm and 8.0 mm for the female connectors. Thanks to the sophisticated design of the tools, the otherwise time-intensive planning and production of new injection moulds is minimised. This enables ERNI to respond flexibly and quickly to customer requests, whilst reducing the costs for logistics.
The MicroCon connectors are designed for parallel (board-to-board and Mezzanine), orthogonal (90 degrees) and coplanar PCB connections. With versions with various heights for the female and male connectors, it is possible to realise different board-to-board distances of 5 to 10 mm (later up to 20 mm) for Mezzanine applications. For connections over greater distances, IDC ribbon cable connections are provided for AWG 34 cables.
The dual-row MicroCon series with 0.8mm pitch is ideal for a wide range of demanding applications in the industrial, medical, lighting, automotive and consumer electronics market. It constitutes a complementary extension to the dual-row SMC family with 1.27mm pitch and the MicroStac family with a hermaphroditic 0.8mm pitch design. In spite of the compact design, it is just as robust and reliable as ever. Even in the basic version, the male connectors have a reinforced outer wall. What is more, besides the coding, a ‘blind mate’ guide with an increased locking range helps to ensure secure mating.
For the MicroCon family, ERNI Electronics has also retained two essential design features in the miniaturised 0.8mm pitch. A unique feature for connectors in this size is the use of double-sided spring contacts for secure mating and a high level of reliability. ERNI has successfully further developed this patented spring contact principle over a number of years and scaled it down for smaller pitches. Consequently, in spite of their miniaturised design, the MicroCon connectors offer a high mating tolerance with permissible misalignment tolerances in the longitudinal and transverse axes of +/- 0.7 mm. The angular inclination tolerance is +/- 4 degrees.
Whereas many manufacturers mate the male connectors on the rough stamped side, which minimises the current capacity and the number of mating cycles, ERNI also stamps the contacts, but twists the contact tulip by 90 degrees. This permits mating on the smooth rolled surface, thus ensuring reliable contact making and high current capacity.
The MicroCon connectors are designed for automatic SMT assembly. To this end, besides the SMT connection, the female connector features a plastic housing, which is also resistant to the high temperatures encountered during lead-free reflow soldering. In addition, the MicroCon connectors are suitable for double-sided reflow soldering. The connectors are supplied in tape & reel packaging to facilitate automatic assembly. The robust connectors are specified for > 500 mating cycles and afford a current capacity per contact of up to 2.3 A at 20°C. The solder terminal is tin-plated.
ERNI Electronics is presenting the extended MicroCon family and the new manufacturing concept at electronica (hall 10, booth 1068).