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HCL-Foxconn Announce OSAT Joint Venture to Strengthen India’s Semiconductor Ecosystem

The Union Cabinet chaired by the Prime Minister Shri Narendra Modi today approved the establishment of one more semiconductor unit under India Semiconductor Mission.

Already five semiconductor units are in advanced stages of construction.  With this sixth unit, Bharat moves forward in its journey to develop the strategically vital semiconductor industry.

The unit approved today is a joint venture of HCL and Foxconn.  HCL has a long history of developing and manufacturing hardware.  Foxconn is a global major in electronics manufacturing.  Together they will set up a plant near Jewar airport in Yamuna Expressway Industrial Development Authority or YEIDA.

This plant will manufacture display driver chips for mobile phones, laptops, automobiles, PCs, and myriad of other devices that have display.

The plant is designed for 20,000 wafers per month.  The design output capacity is 36 million units per month. Semiconductor industry is now shaping up across the country.  World class design facilities have come up in many states across the country.  State governments are vigorously pursuing the design firms.

Students and entrepreneurs in 270 academic institutions and 70 startups are working on world class latest design technologies for developing new products.  20 products developed by the students of these academic students have been taped out by SCL Mohali.

The new semiconductor unit approved today will attract investment of Rs 3,700 crore. As the country moves forward in semiconductor journey, the eco system partners have also established their facilities in India.  Applied Materials and Lam Research are two of the largest equipment manufacturers.  Both have a presence in India now.  Merck, Linde, Air Liquide, Inox, and many other gas and chemical suppliers are gearing up for growth of our semiconductor industry.

With the demand for semiconductor increasing with the rapid growth of laptop, mobile phone, server, medical device, power electronics, defence equipment, and consumer electronics manufacturing in Bharat, this new unit will further add to Prime Minister Shri Narendra Modiji’s vision of Atmanirbhar Bharat.


Ashok Chandak, President IESA and SEMI India
The Cabinet’s approval of the HCL–Foxconn OSAT joint venture marks a strategic milestone in India’s semiconductor journey,” “With an investment of ₹3,700 crore, the project brings large scale advanced packaging and testing capabilities specifically for display driver ICs—addressing a critical gap in India’s display and electronics value chain.

This isn’t just about building infrastructure—it reflects India’s growing maturity in semiconductor manufacturing, with trusted partners, strategic intent, and industrial scale.” Commented Ashok Chandak, President IESA and SEMI India.

Foxconn, one of the world’s largest electronics manufacturers, brings world-class expertise in chip packaging and testing—core to the downstream semiconductor supply chain. HCL Group, with its robust technology services, engineering strength, and global relationships, adds local execution capability and talent access.

“Together, this joint venture lays the foundation for India to emerge as a preferred global hub for semiconductor OSAT operations—truly aligning with the vision of ‘Make in India, Make for the World with great support from center and states and This project can become landmark as it can create major value addition in India’s electronics manufacturing for Mobiles, Laptops, Consumer, Automotive, etc. . ” Chandak added.

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